Auto Mold Chase
-
IC Package
Transfer Molding Chase
- * Compatible with all Auto Mold Systems
- * Custom Specs
-
Compression Molding Chase
(C-Mold)
- * Powder EMC Chase
- * Minimized Wire Sweep
-
Power Package
Transfer Molding Chase
- * Compatible with All Auto Mold Systems
- * Custom Specs
Manual Mold
-
MGP Mold
(Multi Gang Pot Mold)
- * Optimal Mold Flow
- * Compound saving
- * Full MGP * Semi MGP
- * BTM Transfer
-
QCC MGP Mold
(Quick Change Chase)
- * Fast & Easy Maintenance
- * Almost the same as AMS Chase
- * BTM Transfer
-
Retractable E-Pin Mold
- * 2-step Eject-Pin Moving During Molding
- * Compatible with Top & BTM
- * BTM Transfer
-
Conventional Mold
- * Cost-Effective Standard
- * Top Transfer
Book Mold
-
Conventional Book Mold
- * Sample Test
- * Low-Volume Production
- * Cost-effective Standard
- * Top Transfer
-
Hinge type Book Mold
- * Sample Test
- * Small Production
- * Easy Loading
- * Top Transfer
-
QCC MGP Book Mold
- * Mass Production Capable
- * Mini-Pellet Compatible
- * BTM Transfer